ISBN-10: 1118405803

ISBN-13: 9781118405802

ISBN-10: 1574981536

ISBN-13: 9781574981537

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Extra info for Advances in Joining of Ceramics, Volume 138

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3 RESULTS AND DISCUSSION Figure 2 shows the crack kink angle, 0 m , as a function of the equivalent stress intensity factor, KiE, in a 5-layer joint for different interlayer thicknesses. Note that Kie is the result of superposing the applied and residual stress intensity factors at the crack tip, and determining the effective stress intensity factor for a kinked crack. It is a measure of the driving force at the crack tip, assuming the crack will propagate in the direction 0 m , which is the direction of maximum 53 Advances in Joining of Ceramics 38 tensile stress.

Tyszka, and E. D. Case, "Grain size, density and Mechanical Properties of alumina batch-processed in a single mode microwave cavity," Materials Research Bulletin, 32[3]: 287-295,1997. 31. T. P. Hoepfher and E. D. , Westerville, OH, 2000. 32. Y. Lee, E. D. Case, J. , and M. Siegel, "Binder Burnout in a Controlled Single-Mode Microwave Cavity," Scripta Materialia, 35[1]: 107-111,1996. 33. Y. D. Case, J. Asmussen, "Binder Burnout for ceramics and ceramic matrix composites using a single-mode microwave cavity," pp.

1 (a)) and the S-L curves shown in Fig. 2. The mechanism maps show the dominant mechanism in each domain 4>. The index I/D shown in Fig. 4 is obtained by I / D = (8) and indicates the contribution ratio of the interface diffusion against the total diffusion mechanisms to the bonding rate dS/dt. The solid line at the boundary between domains of creep (or diffusion) and plastic deformation expresses the initial contact ratio S0 due to the plastic deformation mechanism. The dotted curve of "Diffusion 70%" means that the contribution of diffusional mechanisms (interface and volume diffusion) is 70% to the total bonding rate.

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